Advancements in Ultrasonic Analysis Symposium


Schedule
Wednesday, May 9th
Thursday, May 10th

Wednesday, May 9th

9:00 am
Registration Opens

9:00 am – 10:00 am
Continental Breakfast and Welcome-(sponsored by Sonix)

 

10:00 am - 11:30 am  Session WA1
Laser Ultrasonic Techniques
Chair:  Eric Irwin - Sonix Inc.

10:00 am

Generation Mechanisms For Laser Ultrasonics
Adam Friedman, Mark Hinders (The College of William and Mary - USA)
Eric Madaras (NESB, NASA Langley Research Center - USA)
Robert Anastasi (US Army Research Laboratory, Vehicle Technolody Center - USA)

 

10: 30 am

A Laser Based System For Rapid Aircraft Lap Joint Inspection
Donatella Cerniglia (University of Palermo - Italy )
B. Boro Djordjevic (Johns Hopkins University, CNDE - USA)

 

11:00 am - 11:30 am

Coffee Break (sponsored by Sonix)

 

11:30 am - 12:30 pm Session WA2  
Specialized Ultrasonic Techniques

Chair:  Eric Irwin - Sonix Inc.

11:30 am

Ultrasonic Lamb Wave Diffraction Tomography
Eugene Malyarenko (Nascent Technology Solutions – USA)
Mark K. Hinders (The College of William and Mary - USA)

 

12:00 pm

Ultrasonic Microstructural Analyzer
Manny Butera (Sonix Incorporated - USA)

 

12:30 pm - 2:00 pm Lunch

 

2:00 pm - 3:30 pm Session WP
Medical Ultrasonic Techniques

Chair:  Manny Butera - Sonix Inc.
2:00 pm

Dynamic Elastography for Detection of Hypoechoic Prostate Cancers
Mark Hinders (The College of William and Mary - USA)
Allison Roberts (NASA Langley Research Center – USA)
Shelley Huang (Marconi Medical Systems – USA)

 

2:30 pm

Periodontal Disease Diagnosis Using an UltraSonographic Probe
J.E. Lynch, Mark Hinders (The College of William and Mary - USA)
G.B. McCombs (Old Dominion University – USA)

 

3:00 pm

Using Ultrasound Imaging to Measure and Reconstruct Tongue Surface Behavior During Speech
Andrew Lundberg, Maureen Stone, Changsheng Yang (University of Maryland – USA)

 

6:30 pm
Dinner at The Chart House
Sponsored by Sonix Inc.

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Thursday, April 6th

9:00 am – 10:00 am
Registration is Open
Continental Breakfast -(sponsored by Sonix)

 

10:00 am - 11:00 am Session THA1
Scanning Acoustic Microscopy
Chair:  Teri Penn - Sonix Inc.
10:00 am

Acoustic Inspection of Bonded and Bumped Wafers
John Goings (Sonix Incorporated - USA)

 

10:30 am

Utilizing Ultrasound in the Determination and Classification of Self Induced Defects During Failure Analysis
Damon Rachell (MEFAS - USA)

 

11:00 am - 11:30 am

Coffee Break (sponsored by Sonix)

 

11:00 am - 12:30 pm Session THA2
Scanning Acoustic Microscopy:  Inspection of Power Electronics
Chair:  Teri Penn - Sonix Inc.
11:30 am

Thermal Impedance Measurement in Power Semiconductor Modules
D.C. Katsis, J.D. van Wyk (Virginia Polytechnic Institute And State University – USA)

 

12:00 pm

Reliability Assessment of Solder Joint Interconnection for Power Chips
Xingsheng Liu, Guo-Quan Lu (Virginia Polytechnic Institute And State University – USA)

 

12:30 pm - 2:00 pm Lunch

 

2:00 pm - 3:00 pm Session THP1
New Techniques:  Hardware
Chair:  John Goings - Sonix Inc.
2:00 pm

Piezocomposite Transducer Design
Rick Cahill  (Krautkramer Incorporated - USA)

2:30 pm

On-Line Large Area Ultrasonic Imaging Using Ultrasound Camera Technology
Bob Lasser, Marvin Lasser, David Rich, John Kula, Stephen Pantano (Imperium Incorporated – USA)

 

3:00 pm - 3:30 pm

Coffee Break (sponsored by Sonix)

 

3:30 pm - 5:00 pm Session THP2
New Techniques:  Imaging
Chair:  John Goings - Sonix Inc.
3:30 pm

Ultrasonic Imaging of Material Condition Using Advanced Simplified Ultrasonic CT
Kyung Cho Kim  (National Research Institute for Metals - Japan)

 

4:00 pm

Frequency Domain Filtering for Improved Scanning Acoustic Microscopy
James C.P. McKeon (Sonix Incorporated – USA)

 

4:30 pm

Nonlinear Acoustic Imaging and Quantitative Acoustic Microscopy
Roman Gr. Maev (University of Windsor – Canada)

 

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