Technical Papers: Scanning Acoustic Microscopy
U.S. Patents related to SAM Technology and its applications:
- USP #6,335,571
- USP #6,306,683
- USP #6,348,738
- USP #6,342,400
- USP #6,032,534
- USP #5,827,970
Thermal Conductivity
In-Situ Measurement of Chip Temperatures During Soft Solder Die Bonding Using Integrated Microsensors
L.Plattner, M. Mayer, C. Luchinger, O.Paul and H. Baltes
1999 International Symposium on Microelectronics (IMAPS) Proceedings, pp. 213-220
Thermal Resistance Degradation of Alloy Die Attached Power Devices during Thermal Cycling
J. Naderman, F.W. Ragey, D.G. de Vries, A. van Eck, and J van de Water
1998 IEEE International Reliability Physics Symposium (IRPS) Proceedings, pp. 248-253
Characterization of Interfacial Thermal Resistance by Acoustic Microscopy
J. Goings, J. Sigmund, S. Haque and G. Lu
1999 Virginia Tech University Power Electronics Symposium
Thermal Management of Power Electronics Modules via Acoustic Microscopy Imaging
J. Goings, S. Haque, X. Liu and G. Lu
2000 APEC Conference Proceedings
The Effect of Die Attach Layer Delamination on the Thermal Performance of Plastic Packages
A.Chowdhury, B.Guenin, C.Woo, S.Kim, S. Lee
1998 ECTC Conference Proceedings
Experiment-Based Computational Investigation of Thermomechanical Stresses in Flip Chip BGA Using the ATC4.2 Test Vehicle
D. Peterson, L. Nguyen, S. Burchett, and J. Sweet
1999 Surface Mount Technology Association (SMTA) Proceedings, pp. 167-175
Integrated Liquid Cooling System for the Thermal Management in LTCC Multilayer
R. Bauer and V. Strickert
2000 Pan Pacific Conference Proceedings, pp. 1-6
Characterization of Interfacial Thermal Resistance by Acoustic Microscopy Imaging
J. Goings, S. Haque, G. Lu, and J. Sigmund
Microelectronics Reliability 40 (2000), pp. 465-476
Bond Integrity: Trade-Offs Between Electrical Thermal and Mechanical Performance
T. Ellis
Chip Scale Review, August-September 2001, pp. 47-53
Hybrids, Multi-Chip Modules and Power Devices
Thermal Resistance Degradation of Alloy Die Attached Power Devices during Thermal Cycling
J. Naderman, F.W. Ragey, D.G. de Vries, A. van Eck, and J van de Water
1998 IEEE International Reliability Physics Symposium (IRPS) Proceedings, pp. 248-253
Characterization of Interfacial Thermal Resistance by Acoustic Microscopy
J. Goings, J. Sigmund, S. Haque and G. Lu
1999 Virginia Tech University Power Electronics Symposium
Characterization of Interfacial Thermal Resistance by Acoustic Microscopy Imaging
J. Goings, S. Haque, G. Lu, and J. Sigmund
Microelectronics Reliability 40 (2000), pp. 465-476
Characterisation and Reliability Testing of a Vertical MCM Technique Using Test Chips
J. Barrett, et. al.
Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies, Windsor, U.K., June 8-10, 1994
Wafer Applications
Acoustic Inspection of Bonded and Bumped Wafers
J. Goings and J. Stradling
2nd Edition of TAPTechnology
Reliability Inspection and Yield Enhancement of Wafer Bonding Using Scanning Acoustic Microscopy
J. Goings
US Tech (December 2001)
Flip Chip Reliability
Flip-Chip on Laminate Reliability - Failure Mechanisms
M. Roesch, R. Teichner, and R. Martens
1999 International Symposium on Microelectronics (IMAPS) Proceedings, pp. 421-426
Initial Development Work on a High Throughput Low Cost Flip Chip on Board Assembly Process
L. McGovern, and D. Baldwin
1997 International Symposium on Microelectronics (IMAPS) Proceedings, pp. 284-289
Influences of Fan-in/Fan-out Structure on Underfill Fillet on TCT Reliability of Flip Chip BGA
H. Shimoe, et. al.
1998 IEEE International Reliability Physics Symposium (IRPS) Proceedings, pp. 254-259
Flip Chip Underfill Reliability of CSP During IR Reflow Soldering
Y. Ohshima, T. Nakazawa, K. Doi, H. Aoki and Y. Hiruta
1997 IEEE International Reliability Physics Symposium (IRPS) Proceedings, pp. 124-128
Simple Flip Chip Analysis Strategies
R. L. Tubbs
1998 International Symposium for Testing and Failure Analysis (ISFTA) Proceedings, pp. 307-316
Failure Analysis of Advanced Microprocessors Through Backside Approaches
D. Davis, O. Diaz de Leon, L. Hughes, S. Pabbisetty, R. Parker, P. Scott, C. Todd, J. Widaski, G. Wilhite, K.S. Wills, and J. Zhu
1998 International Symposium for Testing and Failure Analysis (ISFTA) Proceedings, pp. 473-482
Failure Analysis of Flip Chip Interconnections Through Acoustic Microscopy
O. Diaz de Leon et. al.
1996 International Symposium for Testing and Failure Analysis (ISFTA) Proceedings
Acoustic Microscopy of Flip Chip Packages
J. Sigmund and M. Kearney
1999 Pan Pacific Microelectronics Symposium, pp. 52-54
Reliability Analysis of Overhanging Eutectic Flip Chip Bumps
J. Dixon and D. Adams
1998 Advanced Technology Workshop on Low Cost Flip Chip Technology Proceedings
Wafer Scale Packaging Based on Underfill Applied at Wafer Level for Low Cost Flip Chip Processing
C. D. Johnson and D. F. Baldwin
1999 International Conference on High Density Packaging and MCMs Proceedings, pp. 371-375
Flip Chip Underfill Reliability of CSP During IR Reflow Soldering
Y. Ohshima, T. Nakazawa, K. Doi, H. Aoki and Y. Hiruta
1997 IEEE International Reliability Physics Symposium (IRPS) Proceedings, pp. 124-128
Design for Reliability in Flip Chip Applications
J. Leal, H.Yang and P. Neathway
1999 International Conference on High Density Packaging and MCMs Proceedings, pp. 376-382
Flip-Chip on Laminate Reliability - Statistics and Failure Distributions
R. Martens and M. Roesch
EEP-Vol. 26-1, 1999 Advances in Electronic Packaging ASME, pp. 189-194
Tomographic Acoustic Micro-Imaging (TAMI) Improves Acoustical Analysis of Flip Chip Packages
J. Goings, J. Sigmund and M. Kearney
EEP-Vol. 26-1, 1999 Advances in Electronic Packaging ASME, pp. 855-858
Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials
R. Thorpe and D. Baldwin
1999 Surface Mount Technology Association (SMTA) Proceedings, pp. 153-158
Characterisation of Chip-On-Board and Flip Chip Packaging Technologies by Acoustic Microscopy
W. Lawton and J.Barrett
Microelectronics Reliability, Volume 36, Number 11,12, pp. 1803-1806, 1996
Experiment-Based Computational Investigation of Thermomechanical Stresses in Flip Chip BGA Using the ATC4.2 Test Vehicle
D. Peterson, L. Nguyen, S. Burchett, and J. Sweet
1999 Surface Mount Technology Association (SMTA) Proceedings, pp. 167-175
Processing and Reliability of Low Cost Flip Chip Assemblies Implementing Fast-Flow, Snap-Cure Underfills
P. Houston, D. Baldwin, M. Deladisma, L. Crane and M. Konarski
1999 Surface Mount Technology Association (SMTA) Proceedings, pp. 182-192
Detecting Underfill Delamination and Cracks in Flip Chip on Board Assemblies Using Infrared Microscope
J. Lu, A. Trigg, J. Wu, and T. Chai
International Journal of Microcircuits and Electronic Packaging, Volume 21, Number 3, Third Quarter 1998, pp. 231-235
Characterisation of Chip on Board and Flip Chip Packaging Technologies by Acoustic Microscopy
W. Lawton, J. Barrett
Proc. of the European Symp. on Reliability of Electron Devices, October 1996, pp. 1803-1806
Reliability and Failure Analysis of No-Clean Flip Chip Assembly
J.C.Chang, Y.C.Liang and I.S.Peng
2000 Pan Pacific Conference Proceedings, pp. 219-221
Chip Scale Polymer Stud Grid Array Packaging and Reliability Based on Low Cost Flip Chip Processing
D. Baldwin, S. Sitaraman, and C.P.Wong
2000 International Conference on High-Density Interconnect and Systems Packaging, pp. 118-122
Compatibility of Flux and Underfill Material Systems
W. Tsai, P. Houston, and D. Baldwin
2000 International Conference on High-Density Interconnect and Systems Packaging, pp. 598-604
Thermal Cycling Effects on Eutectic Flip-Chip Die on Organic Packages
M. Sylvester, D. Banks, D.Huu and R. Kern
2000 International Conference on High-Density Interconnect and Systems Packaging, pp. 438-443
Improving Flip-Chip Manufacturing Through Proper Cleaning
M. Todd and M. Dixenman
Advanced Packaging, Jan. 2001, pp. 40-49
Fast Underfill Processes for Large to Small Flip Chips
A. Babiarz, H. Quinones, and R. Ciardella
2001 Pan Pacific Conference Proceedings. pp. 55-58
How New Developments in Hydrofluorocarbon Cleaning Technology Impact Flip-Chip Package Production
A. Merchant and M. Bixenman
Chip Scale Review, Jan/Feb 2001, pp. 88-91
Reliability Studies of Flip Chip Package with Reflowable Underfill
T. Wang, T. Chew and L. Foo
2001 Pan Pacific Conference Proceedings. pp. 65-70
Transfer Molding Encapsulation of Flip Chip Array Packages
L. Rector, S. Gong, et. al.
The International Journal of Microcircuits and Electronic Packaging, Volume 23, Number 4, 2000. Pp. 400-406
Flip Chip Reliability Modeling Based on Solder Fatigue as Applied to Flip Chip on Laminate Assemblies
S. Popelar, M. Roesch
The International Journal of Microcircuits and Electronic Packaging, Volume 23, Number 4, 2000. pp. 462-468
Nondestructive Methodology for Standoff Height Measurement of Flip Chip on Flex (FCOF) by SAM
C.W.Tang et. al.
IEEE Transactions on Advanced Packaging, May 2001, pp. 163-168
The Assembly Analytical Forum: Addressing The Analytical Challenges Facing Packaging and Assembly
T. Moore, C. Hartfield, et. al.
Electronic Device Failure Analysis, Issue 4, Volume 3, November 2001. Pp. 15-19
Chip Scale Packaging (CSP) Reliability
Flip Chip Underfill Reliability of CSP During IR Reflow Soldering
Y. Ohshima, T. Nakazawa, K. Doi, H. Aoki and Y. Hiruta
1997 IEEE International Reliability Physics Symposium (IRPS) Proceedings, pp. 124-128
New Technologies Improve Scanning Acoustic Imaging Throughput of CSP Reliability Inspection
J. Goings
July 2000 Chip Scale Review, (in review)
A Simple Flex-CSP and Its Reliability
Y. Chiou, T. Chen, Y. Hu, C. Wu and S. Lai
2000 Pan Pacific Conference Proceedings, pp. 315-330
Chip Scale Polymer Stud Grid Array Packaging and Reliability Based on Low Cost Flip Chip Processing
D. Baldwin, S. Sitaraman, and C.P.Wong
2000 International Conference on High-Density Interconnect and Systems Packaging, pp. 118-122
Scanning Acoustic Microscopy and CSP Applications
J. Goings
November 2001 Garden State IMAPS Chapter Meeting
Analysis of Reliability Concerns in Underfilled Flip Chips Using Scanning Acoustic Microscopy
J. Goings, B. Oliver and T. Snively
White paper (unpublished)
Encapsulants
Importance of Molding Compound Chemical Shrinkage in the Stress and Warpage Analysis of PQFP's
G. Kelly, C. Lyden, W. Lawton, J. Barrett, A. Saboui, H. Pape, H. Peters
IEEE Transactions on Components, Hybrids and Manufacturing Technology, Part B: Advanced Packaging, Vol 19 No. 2, May 1996, pp 296-300
Glob-Top Reliability Characterisation: Evaluation and Analysis Methods
R. Doyle, B. O Flynn, W. Lawton, J. Barrett, J. Buckley
IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 21, No. 2, June 1998, pp. 292-300
Chip-On-Board for Large Area Die - An Assessment of Low Stress Glob-Top Materials
Rory Doyle, Brendan O'Flynn, John Barrett, Orla Slattery, Willie Lawton
International Journal of Microcircuits & Electronic Packaging; Vol. 17, No. 4, Fourth Quarter 1995, 1063-1674
Chip-On-Board For Large Area Die - An Assessment Of Low Stress Glob-Top Materials
R. Doyle, B. O'Flynn, J.Barrett, O. Slattery and W. Lawton
Proceedings of the International Conference on Multichip Modules, Denver, Colorado, April 19-21, 1995, pp. 524-530
A Review of Glob-Top Encapsulation Methods for Non-Standard Chip-On-Board Applications
J. Barrett, R. Doyle, W. Lawton, B. O'Flynn, M. O'Reilly, O. Slattery, M. Wiseman
Proceedings of Adhesives in Electronics '94, Berlin, 2 - 4 November, 1994, pp. 370-377
Glob-top Encapsulation of MCM-L and SCP Using Large Area Die
B. O Flynn, R. Doyle, J. Barrett, O. Slattery, W. Lawton
European Multichip Module Conference, London, January 1997
Novel Transfer Molding Technique for Encapsulating PBGA Packages
R. Molnar
2000 Pan Pacific Conference Proceedings, pp. 281-289
Effect of Plasma Clean, Polyimide, and Mold Compound on Thin MAP Package Delamination
J. Miller, M. Leoni, T. Thompson and D. Teng
2000 International Conference on High-Density Interconnect and Systems Packaging, pp. 605-609
Die Attach and Encapsulants for High-Temperature Reflow
R. Jaeger, et. al.
HDI, May 2001, pp. 36-42
Ball Grid Array Reliability
Reliability of FBGA (Fine Pitch BGA) Package using PCB Substrate
E. Ahn, T. Cho, H. Hyun, T. Chung, and S. Oh
1999 International Symposium on Microelectronics (IMAPS) Proceedings, pp. 599-604
Through-Transmission Acoustic Inspection of Ball Grid Array (BGA) Packages
T. M. Moore and C.D. Hartfield
1997 International Symposium for Testing and Failure Analysis (ISFTA) Proceedings, pp. 197-204
Glob Top Plastic Ball Grid Array Package Encapsulation Process Development and Its Moisture Sensitivity Study
L.Y.Yang, E.Padrino and Y.C.Mui
International Journal of Microcircuits and Electronic Packaging, Volume 21, Number 3, Third Quarter 1998, pp. 262-273
Non-Destructive Inspection Methods for Surface Mounted Plastic Ball Grid Array Packages
J.Sigmund and M.Kearney
Sonix, Inc. (unpublished)
Novel Transfer Molding Technique for Encapsulating PBGA Packages
R. Molnar
2000 Pan Pacific Conference Proceedings, pp. 281-289
The Assembly Analytical Forum: Addressing The Analytical Challenges Facing Packaging and Assembly
T. Moore, C. Hartfield, et. al.
Electronic Device Failure Analysis, Issue 4, Volume 3, November 2001. Pp. 15-19
Scanning Acoustic Microscopy: Analytical Procedures and Techniques for Metal Ball Grid array (MBGA) Substrates
J.Goings, A. Benjamin, and L. Strauman
White paper (unpublished)
Substrates
Realization of LTCC-Multilayer with Special Cavity Applications
R. Bauer, M. Luniak, and L. Rebenklau
1997 International Symposium on Microelectronics (IMAPS) Proceedings, pp. 659-664
Non-Destructive Method of Determining Substrate Tilt Within a Packaged Semiconductor Component
I.Poku, R.Cherkur, Y.Matsuda
US Patent Number 5,827,970
Buried Passive Component Realisation In Low Temperature Cofired Ceramic For MCM-C Substrate Applications
R. Doyle, J. Barton, K. Delaney, J. Barrett, J. P. Bertinet, E. Polzer
Proc. NATO Advanced Research Workshop, Budapest, May 18-20, 1995
Moisture Testing and Reliability
Method for Equivalent Acceleration of JEDEC/IPC Moisture Sensitivity Levels
R. Shook, B. Vaccaro, and D. Gerlach
1998 IEEE International Reliability Physics Symposium (IRPS) Proceedings, pp. 214-219
Moisture Sensitivity Characterization of Plastic Surface Mount Devices Using Scanning Acoustic Microscopy
R. Shook
1992 International Reliability Physics Symposium (IRPS) Proceedings, pp. 157-168
Glob Top Plastic Ball Grid Array Package Encapsulation Process Development and Its Moisture Sensitivity Study
L.Y.Yang, E.Padrino and Y.C.Mui
International Journal of Microcircuits and Electronic Packaging, Volume 21, Number 3, Third Quarter 1998, pp. 262-273
Surface Mount Technology
Critical Parameters for Reliable Surface Mounting of High Pincount Packages
B. Euzent, B. Kawanami, and S. Lau
1998 IEEE International Reliability Physics Symposium (IRPS) Proceedings, pp. 220-224
Moisture Sensitivity Characterization of Plastic Surface Mount Devices Using Scanning Acoustic Microscopy
R. Shook
1992 International Reliability Physics Symposium (IRPS) Proceedings, pp. 157-168
Identification of Package Defects in Plastic-Packaged Surface-Mount ICs by Scanning Acoustic Microscopy
T.Moore
1989 International Symposium for Testing and Failure Analysis
Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials
R. Thorpe and D. Baldwin
1999 Surface Mount Technology Association (SMTA) Proceedings, pp. 153-158
Characterisation of Chip-On-Board and Flip Chip Packaging Technologies by Acoustic Microscopy
W. Lawton and J.Barrett
Microelectronics Reliability, Volume 36, Number 11,12, pp. 1803-1806, 1996
Non-Destructive Inspection Methods for Surface Mounted Plastic Ball Grid Array Packages
J.Sigmund and M.Kearney
Sonix, Inc. (unpublished)
Chip-On-Board for Large Area Die - An Assessment of Low Stress Glob-Top Materials
Rory Doyle, Brendan O'Flynn, John Barrett, Orla Slattery, Willie Lawton
International Journal of Microcircuits & Electronic Packaging; Vol. 17, No. 4, Fourth Quarter 1995, 1063-1674
Scanning Acoustic Microscopy Technology
The Separation of Superimposed Ultrasonics Pulse Echo Signals for Semiconductor Failure Analysis using Scanning Acoustic Tomography (SAT)
H. Jang, K. Jhang, and D. Lee
1997 IEEE International Reliability Physics Symposium (IRPS) Proceedings, pp. 136-140
Acoustic Microscopy of IC Packages
T. M. Moore and C.D. Hartfield
Electronic Failure Analysis Seminar Reference, pp. 79-89
Parallel Projection and Crosshole Lamb Wave Contact Scanning Tomography
J.C.P. McKeon and M.K. Hinders
J. Acoust. Soc. Am., submitted for publication, 1998
Lamb Wave Scattering From A Through Hole
J.C.P. McKeon and M.K. Hinders
J. Sound Vibration, submitted for publication, 1998
Ultrasonic Lamb Wave Tomographic Scanning
M.K. Hinders, E.V. Malyarenko, and J.C.P. McKeon
Spring 1999 SPIE Conference: Nondestructive Evaluation Techniques for Aging Infrastructure and Manufacturing, 3-5 March 1999
Lamb Wave Contact Scanning Tomography
J.C.P. McKeon and M.K. Hinders
To appear in Rev. Prog. QNDE, Vol. 18, 1999
Contact Scanning Lamb Wave Tomography
M.K. Hinders, E.V. Malyarenko, and J.C.P. McKeon
Abstract, J. Acoust. Soc. Am., 104(3):1790 1998
Lamb Wave Tomography For Corrosion Mapping
M.K. Hinders and J.C.P. McKeon
The Second Joint NASA/FAA/DoD Conference on Aging Aircraft, 31 August - 3 September 1998
Nondestructive Analysis for HDI Packages
K. McCray
HDI, November 1998, pp. 12-13
Localization of Defects in Die-Attach Assembly by Continuos Wavelet Transform Using Scanning Acoustic Microscopy
L.Bechou, L.Angrisiani, Y.Ousten, D.Dallet, H. Levi, P.Daponte and Y.Danto
1999 Elsevier Science Ltd.
Mapping Stress with Ultrasound
E. Drescher-Krasicka and J.R. Willis
Nature, Volume 384, 7 November 1996, pp. 52-55
Method for Identifying Molding Compound Using an Acoustic Microscope
W.Wang, S.Sue
US Patent Number 5,631,425
Simulated Scanning for Efficient Scanning Acoustic Microscopy
J.C.P.McKeon
2000 Pan Pacific Conference Proceedings. pp. 71-77
Localization of defects in die-attach assembly by Continuous Wavelet Transform Using Scanning Acoustic Microscopy
L. Bechou, L. Angrisiani, et. al.
1999 Elsevier Science
The Assembly Analytical Forum: Addressing The Analytical Challenges Facing Packaging and Assembly
T. Moore, C. Hartfield, et. al.
Electronic Device Failure Analysis, Issue 4, Volume 3, November 2001. Pp. 15-19
Does TAMI Lose Detection Capabilities?
J. Goings
White paper (unpublished)
Electrical Performance or ESD Reliability
ESD Protection Using Active Area Bonding
J.C. Bernier, and L. Teems
1998 International Symposium for Testing and Failure Analysis (ISFTA) Proceedings, pp. 393-398
Identification of Electrical Overstress Failures in Semiconductor Devices Using Acoustic Microscopy
J.Y.Glacet
1993 International Symposium for Testing and Failure Analysis (ISFTA), pp. 161-166
Characterisation of the electrical performance of Buried Capacitors and Resistors in Low Temperature Co-fired (LTCC) Ceramic
K. Delaney, J. Barrett, J. Barton, R. Doyle
Proceedings of the 48th Electronic Components & Technology Conference, May 25-28, 1998, Seattle, pp 900-908
Bond Integrity: Trade-Offs Between Electrical Thermal and Mechanical Performance
T. Ellis
Chip Scale Review, August-September 2001, pp. 47-53
Plastic Package Reliability
ESD Protection Using Active Area Bonding
J.C. Bernier, and L. Teems
1998 International Symposium for Testing and Failure Analysis (ISFTA) Proceedings, pp. 393-398
Moisture Sensitivity Characterization of Plastic Surface Mount Devices Using Scanning Acoustic Microscopy
R. Shook
1992 International Reliability Physics Symposium (IRPS) Proceedings, pp. 157-168
The Effect of Die Attach Layer Delamination on the Thermal Performance of Plastic Packages
A.Chowdhury, B.Guenin, C.Woo, S.Kim, S. Lee
1998 ECTC Conference Proceedings
Acoustic Microscopy of IC Packages
T. M. Moore and C.D. Hartfield
Electronic Failure Analysis Seminar Reference, pp. 79-89
Low Temperature Delamination of Plastic Encapsulated Microcircuits
P. McClusky, F. Lilie, O. Beysser, and A. Gallo
Identification of Electrical Overstress Failures in Semiconductor Devices Using Acoustic Microscopy
J.Y.Glacet
1993 International Symposium for Testing and Failure Analysis (ISFTA), pp. 161-166
Failure Analysis Techniques for TIPI Packaging Issues
R.Angeles, A.Panopio, P.Palasi
1999 Texas Instruments Research Report
Identification of Package Defects in Plastic-Packaged Surface-Mount ICs by Scanning Acoustic Microscopy
T.Moore
1989 International Symposium for Testing and Failure Analysis
SAM Provides Critical IC Inspection
T.Moore
Oct. 1990 Advanced Materials and Processes
C-mode Acoustic Microscopy Applied to Integrated Circuit Package Inspection
T.Moore
Solid State Electronics. 35 (3), pp.411-421, 1992
Reliable Delamination Detection by Polority Analysis of Reflected Acoustic Pulses
T.Moore
1991 International Society for Testing and Failure Analysis (ISFTA) Proceedings, pp. 49-51
Non-Destructive Method of Determining Substrate Tilt Within a Packaged Semiconductor Component
I.Poku, R.Cherkur, Y.Matsuda
US Patent Number 5,827,970
Glob-Top Reliability Characterisation: Evaluation and Analysis Methods
R. Doyle, B. O Flynn, W. Lawton, J. Barrett, J. Buckley
IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 21, No. 2, June 1998, pp. 292-300
Methods of Analysing Thermomechanical Stress in Plastic Packages for Integrated Circuits
O.Slattery, et. al.
Journal of Materials Processing Technology, 54, 1995, pp 199 - 204
Accurate Prediction of PQFP Warpage
G. Kelly, C. Lyden, W. Lawton, J. Barrett, A. Saboui, J. Exposito, F. Lamourelle
Proceedings of the Electronics Components Technology Conference, Washington D.C., May 1994, pp. 977-981
Reliability Issues of the 128M TSOP II 54L Dual Chip Package
J. Fan, M. Chung, F. Tsai and S. Chen
2000 Pan Pacific Conference Proceedings, pp. 309-313
The Effect of Die Attach Layer Delamination on the Thermal Performance of Plastic Packages
A.Chowdhury, B.Guenin, C.Woo, S.Kim, S. Lee
1998 ECTC Conference Proceedings
Ceramic Capacitors
Live and Acoustic
J. Goings
Test Magazine, May 1999, pp. 22-23
Defect Depth Information for Ceramic Multi-Layered Capacitors using TAMI™
J. Goings
White paper (unpublished)
Characterisation of the electrical performance of Buried Capacitors and Resistors in Low Temperature Co-fired (LTCC) Ceramic
K. Delaney, J. Barrett, J. Barton, R. Doyle
Proceedings of the 48th Electronic Components & Technology Conference, May 25-28, 1998, Seattle, pp 900-908
Acoustically Supplied Defect Depth Information for Ceramic Multi-Layered Chip Capacitors using TAMI
J. Goings
White paper(unpublished)
Ceramics
IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 22, No. 1, February 1999, pp. 68-77
Characterisation and Performance Prediction for Integral Capacitors in Low Temperature Co-Fired Ceramic Technology
K. Delaney, J. Barrett, J. Barton, R. Doyle
Characterisation of the electrical performance of Buried Capacitors and Resistors in Low Temperature Co-fired (LTCC) Ceramic
K. Delaney, J. Barrett, J. Barton, R. Doyle
Proceedings of the 48th Electronic Components & Technology Conference, May 25-28, 1998, Seattle, pp 900-908
Reliability of High Pincount Ceramic Quad Flat Pack and Pin Grid Array IC Packages
J. Barrett, A. Boetti, R. Doyle, T. Hayes, W. Lawton, C. O Mathúna, F. Waldron, M. Wiseman
Proceedings of the 2nd ESA Electronics Components Conference, Noordwijk, The Netherlands, May 1993, pp. 117-127
Acoustic Microscopy Investigation of Surface & Interface of CdTe Detectors
J.Barton, T.Randles, S. Hearne, J.Barrett, P.V.Kelly, G.Crean, P.Siffert, JM Koebel
The 11th International Workshop on Room Temperature Semiconductor X- and Gamma-Ray Detectors and Associated Electronics Oct 11-15, 1999 - Vienna, Austria
Buried Passive Component Realisation In Low Temperature Cofired Ceramic For MCM-C Substrate Applications
R. Doyle, J. Barton, K. Delaney, J. Barrett, J. P. Bertinet, E. Polzer
Proc. NATO Advanced Research Workshop, Budapest, May 18-20, 1995
Integrated Liquid Cooling System for the Thermal Management in LTCC Multilayer
R. Bauer and V. Strickert
2000 Pan Pacific Conference Proceedings, pp. 1-6
A Novel Approach for Integrated Passive Device Fabrication
G. Sykora, R. Pabich, J. O'Shea, L. Gleason, C. Sabo, J. Wood, and P. Barnwell
1999 International Symposium on Microelectronics (IMAPS) Proceedings, pp. 505-509
Characterisation of the electrical performance of Buried Capacitors and Resistors in Low Temperature Co-fired (LTCC) Ceramic
K. Delaney, J. Barrett, J. Barton, R. Doyle
Proceedings of the 48th Electronic Components & Technology Conference, May 25-28, 1998, Seattle, pp 900-908
Miscellaneous Microelectronic Applications
Scanning Acoustic Microscopy Investigations of Pyrolytic Carbon
M.Wiedenmeier, G.Hofman, M.Freund, and A. Beavan
Sulzer Carbomedics, Austin, TX (unpublished)
A Practical Method for Characterization and Correlation of Acoustic Microscopes
K.M.Baker
Ford Microelectronics (unpublished)
Analysis of Die Attach and Braze Joint of Metal Flanged Packages Using Acoustic Microscopy
W.Smith and E.Mares
Motorola-Wireless Infrastructure Systems Division, Phoenix, Arizona (unpublished)
Application of Acoustic Microscopy to the Characterisation of Non-standard microelectronic packaging structures
W. Lawton, J. Barrett
Proc. 47th IEEE Electronic Components & Technology Conference, May 1997, pp. 1032-1040
New Die Attach Adhesives that Stick
M.Bonneau
February 2000 Advanced Packaging, pp. 28-32
Localization of defects in die-attach assembly by Continuous Wavelet Transform Using Scanning Acoustic Microscopy
L. Bechou, L. Angrisiani, et. al.
1999 Elsevier Science
Scanning Acoustic Microscopy and SIMS Investigation of CdTe Detectors
J.Barton, T.Randles, S. Hearne, J.Barrett, P.V.Kelly, G.Crean, P.Siffert, JM Koebel
Nuclear Instruments & Methods in Physics Research, Section A - Nuclear Inst. and Methods in Physics Research, A, Jan, 2001, volume 458 issue 1-2, pp 431-436
Truck Axles
Ultrasonic Microstructural Analyzer (UMA)
|
