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Events Schedule
Semicon Korea
January 30, 2008 - Feb 1, 2008
Semicon China
March 18 - 20, 2008
Semicon Singapore
May 5 - 7, 2008
Semicon West
July 15 - 17, 2008
Semicon Taiwan
Sept 9 - 11, 2008
Semicon Europa
Oct 7 - 9, 2008
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We would appreciate your feedback.
Previous years' topics include:
Ultrasonic Testing Using Phased Arrays
Jim Barshinger, Paul A. Meyer, Rick Cahill (Krautkramer Branson - USA)
Advanced Ultrasonic NDE For Non-contact And In-process Composites Monitoring
B. Boro Djordjevic (Johns Hopkins University - USA)
Lamb Wave Tomography For Mapping Flaws In Aging Aircraft Structures
Eugene Malyarenko, Mark K. Hinders (The College of William and Mary - USA), Christopher S. Domack (Nascent Technology Solutions - USA)
Ultrasonic Microstructure Analyzer: Breakthrough In Hardness Depth Measurement
Michael F. Whalen (Sonix™ Incorporated - USA)
Simulated Scanning For Efficient Scanning Acoustic Microscopy
James C. P. McKeon (Sonix™ Incorporated - USA)
Tomographic Acoustic Micro Imaging
John Goings - (Sonix™ Incorporated - USA)
Frequency Domain Filtering For Higher Spatial And Depth Resolution
James C. P. McKeon (Sonix™ Incorporated - USA)
Correlation Of Interfacial Thermal Resistance And Defect Content Of The Heatspreader Interface Of A Power Electronic Module
Shatil Haque, G.-Q. Lu (Virginia Polytechnic Institute And State University - USA), John Goings (Sonix™ Incorporated)
Scanning Acoustic Microscopes Provide Unique View of CSP Reliability At Increased Throughput Rates
John Goings (Sonix™ Incorporated - USA)
Scanning Acoustic Microscopy Of Novel Technologies
J. Barton, T. Compagno, K. Delaney, S. O'Reilly, M. McEnery, S.C. O'Mathuna, and J. Barrett (National Microelectronics Research Center - Ireland)
The Effects Of Sampling Rate On The Quality Of Digitized Ultrasonic Signals
James C. P. McKeon (Sonix™ Incorporated - USA)
Minimum Detectable Defect Size Leaves the Empirical World And Enters The Experimental World
Damon Rachell (Sonix™ Incorporated - USA)
Development of Calibration Test Jigs For Scanning Acoustic Microscopes
J. Barton, T. Randles (National Microelectronics Research Center - Ireland), D. Vanderstraeten, Gust Schols (Alcatel Microelectronics - Belgium), T. Howard (Towcester Technical Services - United Kingdom), P. Groeneveld (Phillips Semiconductor - The Netherlands)
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