Package Inspection Applications

Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time in a nondestructive testing (NDT) solution for package inspection is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.

Sonix has been the innovation leader since 1986. Today, the ECHO line of scanning acoustic microscopes sets the standard for package inspection speed and image quality, to help you keep pace with new packaging materials and difficult form factors. The ECHO platform will remain at the forefront as we continue to add features and enhance performance for years to come.

Choose our ECHO scanning acoustic microscope for package inspection of stacked dies, complex flip chips and more traditional plastic packages. ECHO VS adds industry-leading features for the clearest imaging of Cu pillars, molded flip chip (MUF), CSP, MCM, stacked die, hybrids, and other advanced package inspection applications. The ECHO Pro adds fully automated handling for 100% package inspection in high-volume production environments.

Sonix is ISO 9001/2008 Certified. All of our tools are Semi S2/S8 certified.

Learn advanced inspection techniques for Cu Pillars, molded underfill and stacked die package.
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