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Use the Right Tool to get the Right Result!
Scanning Acoustic Microscopy, commonly referred to as SAM or SAT (Scanning Acoustic Tomography) is unparalleled in its ability to spot delaminations, cracks and other anomalies non-destructively. Not only does acoustic microscopy detect the failures but it also can provide the specific location of the problem. Sonix™ SAMs high resolution images and advanced diagnostic tools are used to:
- Diagnose device failures and discover failure "root causes"
- Monitor production sampling
- Qualify new package or production designs
- Research new materials or processes
The Sonix™ Advantage
The purchase of a Scanning Acoustic Microscope (SAM) is a major decision. A primary consideration in the purchase process is the system must be capable of producing the desired benefits for years to come. In a world of constant technological advances, knowing the "true" architecture of a product is the key to reducing obsolescence, allowing for cost-effective upgrades, and reducing down time through serviceability. Sonix™ utilizes state-of-the-art technology that ensures your investment meets current and future expectations. Below is a listing of our line of SAM systems currently available for a variety of semiconductor inspection needs.
Products
ECHO™
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 Sonix™ ECHO can detect defects as small as 0.05 micron and is an excellent tool for bump detection, stacked die (3D Packaging) inspection, complex flipchip inspection and more traditional plastic packages. |
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Fusion 3600™
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 Combines the best features of the long-standing benchmark HS1000, UHR-2001, and Q350 products into a single Scanning Acoustic Microscope platform updated with the latest production grade components. |
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Vision™
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 Advanced Acoustic Microscopy for stacked die Flip Chips and Bumped Die.
- Failure Analysis
- Reliability testing
- Packaging
- Process control. |
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HT3000™
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 The HT3000 is a SAM tool designed for the needs of production fl oor inspection. It allows for high throughput and automatic handling for either a vertical magazine of trays / boats placed into the system, or trays / boats from a handler fed in through a SMEEMA interface. Each tray / boat is loaded, debubbled, scanned, dried, and unloaded in sequence. |
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| AW3000™ |
 A fully-automated SAM system devoted exclusively for automated, high throughput inspection of wafer substrates, and die bonded to single silicon wafers. Engineered for high throughput, high resolution imaging in a production or process control environment. |
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| Reconditioned Systems |
Occasionally Sonix™ has reconditioned or demo equipment available. These systems carry a full system warranty and many can be upgraded to the latest hardware and software if necessary. Call your local Sonix™ representative for more information or check for system availability. |
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System Options
Few customers have the same inspection needs. Sonix™ offers a variety of hardware and software options to tailor the system for your exact inspection needs.
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