Ultrasonic Package Inspection

Ultrasonic Testing for Reliable Defect Detection in Advanced Packages

Learn best practices for ultrasonic NDT inspection of Cu pillars, molded underfill and stacked die packages.

  • Choose ultrasonic testing frequencies for optimum sample penetration and image resolution
  • Enhance images through improved acoustic coupling
  • Maximize signal gain and signal-to-noise ratio
  • Improve spatial resolution, contrast and edge resolution
  • Equalize signal strength for balanced imaging across multiple layers

You need to identify defects reliably so you can remove them from production, correct the root causes, and produce higher yields of known-good packages. That’s why Sonix has developed industry-leading ultrasonic testing techniques for clearly revealing delaminations, voids, cracks and other defects in today’s most advanced, multilayered semiconductor packages.