Inspect 100% of your MEMS production. Sonix clearly reveals bond-ring voids and incursions into MEMS cavities while delivering the throughput you need to keep manufacturing partners supplied with reliable micro devices.
Bonded Wafer Inspection
Analyze wafer-bond and device-level defects in a single scan. Perform advanced metrology to ensure conformance with manufacturing standards. Fully automate wafer handling and analysis at production speeds.
Packaged Semiconductor Inspection
Assure quality with a clear view of defects in 3D package structures. Sonix can help you optimize inspection accuracy and speed for stacked dies, molded underfill packages, Cu pillars and other advanced applications.
Inspection for Industrial Parts and Supplies
Verify that the products you send to market are free of welding, brazing or adhesive voids. Sonix provides a clear view into the bonded interface for electrical contacts, drill-bit abrasives and other industrial applications.
Since 1986, Sonix has pioneered many of the breakthroughs in defect detection and process productivity that have helped semiconductor manufacturers create a world of new possibilities. Today, manufacturers around the world depend on our scanning acoustic microscope technology for nondestructive inspection of bonded wafers, packaged semiconductors and industrial products. And we continue to lead the way with new ultrasonic technologies and applications to assure the quality of tomorrow’s innovations.