Exclusive: Detect the smallest defects in semiconductor packages and bonded wafers. Perfect integration with our ECHO™ and AutoWafer™ systems
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Sonix pioneered many of the breakthroughs in image quality and process productivity that have helped wafer and chip manufacturers literally transform the world. Our scanning acoustic microscope technology is used by leading manufacturers worldwide to perform nondestructive inspection of bonded wafers and packaged semiconductors, from the development lab to the production floor.
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