Today, front-end manufacturers are adopting nondestructive testing (NDT) as a wafer solution. Manufacturers are performing semiconductor wafer inspection and wafer metrology to help streamline product development, refine manufacturing processes, improve yield and ensure the long-term reliability of their products.
Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time in a nondestructive testing (NDT) solution for package inspection is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.