These downloadable pdf files provide in-depth information about nondestructive testing and evaluation of wafers and packaged semiconductors, acoustic scanning and analysis technologies, inspection best practices and other technical topics.
|Hiding In Plain Sight
|The need for smaller and smarter devices means that bond rings, through-silicon vias (TSVs) and other structures are becoming smaller and more complex.
|Bonded and Bumped Wafers Application Brief
|The ability to detect extremely thin air gaps (<0.1 micron) provides superior imaging for silicon-on-insulator, coated wafers or a variety of other high-end wafer applications.
|Hybrids, Multi-Chip Modules and Power Devices
|See images and analysis illustrating the ability to detect very thin air gaps and penetrate dense metallic materials.
|Acoustic inspection of flip chips helps ensure adequate underfill flow and identify excess flux material.
|Chip Scale Packages
|For CSP failure analysis and process control, the ability to find very thin planar defects (< 0.1 micron) makes acoustic scanning a superior tool for imaging device integrity.
|Plastic Ball Grid Arrays
|Scanning acoustic microscopy is a widely used tool for detecting failure modes such as moisture-induced cracking, or popcorning, and delaminations.
|Metal Ball Grid Arrays
|Sonix systems provide excellent imaging of seal integrity, die attach and lead finger bond quality in SuperBGA and other metal BGA package types.
|Plastic Encapsulated Integrated Circuits
|Download Now Ceramic Chip Capacitors Almost every capacitor manufacturer in the world uses scanning acoustic microscopy in a failure analysis or process control role.
|Ceramic Chip Capacitors
|Almost every capacitor manufacturer in the world uses scanning acoustic microscopy in a failure analysis or process control role.
|Acoustic inspection can help determine the root cause and location of defects in ceramics, whether bare or incorporated within a device.
|Truck Axle Study
|Sonix systems have been used to determine case hardness depths in truck axles, without the need to cut into and destroy the parts.
|Ultrasonic Microstructural Analyzer (UMA)
|The Ultrasonic Microstructural Analyzer (UMA) provides a cost-effective, non-destructive method for measuring the hardness depth of induction hardened steel parts.
|Acoustic microscopy can be used to analyze the boundaries between materials and the property variations within a material.
|Fully automated scanning acoustic microscope systems can be used to inspect thousands of automotive devices per day.
|Smart cards, composites and LTCC substrates are just a few of the applications for Sonix acoustic inspection systems.
|From microelectronic devices to medical packaging, acoustic inspection is indispensible to many medical device manufacturers.
|The Auto Analysis application allows you to set up accept/reject criteria on each device in a tray or jump scan. The result is a pass/fail evaluation report for each device.
|Cluster Analysis can be used to find void size distribution, based on user-defined amplitude and size criteria.
|Time-of-flight is the time taken by ultrasound to propagate from one reference interface to another interface. This information can be used to measure the thickness of bonding layers and other features.
|A palette is used to map pixel values (signal amplitude) to pixel brightness/color to improve image contrast and clarity.
|Void Gate Imaging
|The Void Gate Imaging feature can be used to detect voids in mold compound, superimposing the findings over a meaningful background to aid in determining the defect location.
|Simultaneous Pulse-Echo / Through-Transmission Imaging
|Simultaneous pulse-echo and through-transmission imaging (PETT) enables quick defect detection and verification all in one scan.
|Copper Pillar Inspection
|Learn how to optimize penetration, resolution and contrast at the ultra high frequencies typically required to inspect Cu pillars that can be as small as 10–30μm in diameter.
|Molded Underfill Package (MUF) Inspection
|Minimize the effects of signal scattering, attenuation and shadowing to achieve clear inspection images in packages that incorporate particle-filled overmolding and underfill.
|Stacked Die Package Inspection
|Overcome the challenges of penetrating and resolving multiple layers to achieve clear ultrasonic inspection images in bare and overmolded stacked die packages.
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