Technical Papers

These downloadable pdf files provide in-depth information about nondestructive testing and evaluation of wafers and packaged semiconductors, acoustic scanning and analysis technologies, inspection best practices and other technical topics.

Bonded and Bumped Wafers Application Brief102 KBThe ability to detect extremely thin air gaps (<0.1 micron) provides superior imaging for silicon-on-insulator, coated wafers or a variety of other high-end wafer applications.DOWNLOAD
Hybrids, Multi-Chip Modules and Power Devices127 KBSee images and analysis illustrating the ability to detect very thin air gaps and penetrate dense metallic materials.DOWNLOAD
Flip Chips131 KBAcoustic inspection of flip chips helps ensure adequate underfill flow and identify excess flux material.DOWNLOAD
Chip Scale Packages124 KBFor CSP failure analysis and process control, the ability to find very thin planar defects (< 0.1 micron) makes acoustic scanning a superior tool for imaging device integrity.DOWNLOAD
Plastic Ball Grid Arrays166 KBScanning acoustic microscopy is a widely used tool for detecting failure modes such as moisture-induced cracking, or popcorning, and delaminations.DOWNLOAD
Metal Ball Grid Arrays151 KBSonix systems provide excellent imaging of seal integrity, die attach and lead finger bond quality in SuperBGA and other metal BGA package types.DOWNLOAD
Plastic Encapsulated Integrated Circuits215 KBDownload Now Ceramic Chip Capacitors Almost every capacitor manufacturer in the world uses scanning acoustic microscopy in a failure analysis or process control role. DOWNLOAD
Ceramic Chip Capacitors80 KBAlmost every capacitor manufacturer in the world uses scanning acoustic microscopy in a failure analysis or process control role.DOWNLOAD
Ceramics561 KBAcoustic inspection can help determine the root cause and location of defects in ceramics, whether bare or incorporated within a device.DOWNLOAD
Truck Axle Study46 KBSonix systems have been used to determine case hardness depths in truck axles, without the need to cut into and destroy the parts.DOWNLOAD
Ultrasonic Microstructural Analyzer (UMA) 224 KBThe Ultrasonic Microstructural Analyzer (UMA) provides a cost-effective, non-destructive method for measuring the hardness depth of induction hardened steel parts.DOWNLOAD
Material Characterization 92 KBAcoustic microscopy can be used to analyze the boundaries between materials and the property variations within a material.DOWNLOAD
Automotive Applications146 KBFully automated scanning acoustic microscope systems can be used to inspect thousands of automotive devices per day.DOWNLOAD
Miscellaneous Applications212 KBSmart cards, composites and LTCC substrates are just a few of the applications for Sonix acoustic inspection systems.DOWNLOAD
Medical Applications96 KBFrom microelectronic devices to medical packaging, acoustic inspection is indispensible to many medical device manufacturers.DOWNLOAD
Auto Analysis72 KBThe Auto Analysis application allows you to set up accept/reject criteria on each device in a tray or jump scan. The result is a pass/fail evaluation report for each device.DOWNLOAD
Cluster Analysis53 KBCluster Analysis can be used to find void size distribution, based on user-defined amplitude and size criteria.DOWNLOAD
TOF/Thickness Measurement119 KBTime-of-flight is the time taken by ultrasound to propagate from one reference interface to another interface. This information can be used to measure the thickness of bonding layers and other features.DOWNLOAD
Palette Applications396 KBA palette is used to map pixel values (signal amplitude) to pixel brightness/color to improve image contrast and clarity.DOWNLOAD
Void Gate Imaging174 KBThe Void Gate Imaging feature can be used to detect voids in mold compound, superimposing the findings over a meaningful background to aid in determining the defect location.DOWNLOAD
Simultaneous Pulse-Echo / Through-Transmission Imaging231 KBSimultaneous pulse-echo and through-transmission imaging (PETT) enables quick defect detection and verification all in one scan.DOWNLOAD
Copper Pillar Inspection MBLearn how to optimize penetration, resolution and contrast at the ultra high frequencies typically required to inspect Cu pillars that can be as small as 10–30μm in diameter.DOWNLOAD
Molded Underfill Package (MUF) Inspection1 MBMinimize the effects of signal scattering, attenuation and shadowing to achieve clear inspection images in packages that incorporate particle-filled overmolding and underfill.DOWNLOAD
Stacked Die Package Inspection868 KBOvercome the challenges of penetrating and resolving multiple layers to achieve clear ultrasonic inspection images in bare and overmolded stacked die packages.DOWNLOAD
ABOUT US

© 2022 Sonix. All Rights Reserved.