Inspect 100% of your MEMS production. Sonix clearly reveals bond-ring voids and incursions into MEMS cavities while delivering the throughput you need to keep manufacturing partners supplied with reliable micro devices.

Analyze wafer-bond and device-level defects in a single scan. Perform advanced metrology to ensure conformance with manufacturing standards. Fully automate wafer handling and analysis at production speeds.

Assure quality with a clear view of defects in 3D package structures. Sonix can help you optimize inspection accuracy and speed for stacked dies, molded underfill packages, Cu pillars and other advanced applications.

Verify that the products you send to market are free of welding, brazing or adhesive voids. Sonix provides a clear view into the bonded interface for electrical contacts, drill-bit abrasives and other industrial applications.