Package Inspection Applications

Sonix has been the innovation leader since 1986. Today, the ECHO line of scanning acoustic microscopes sets the standard for PCB inspection speed and image quality, to help you keep pace with new packaging materials and difficult form factors. The ECHO platform will remain at the forefront as we continue to add features and enhance performance for years to come.

Package Inspection Applications

Choose our ECHO scanning acoustic microscope for package inspection of stacked dies, complex flip chips and more traditional plastic packages. ECHO VS adds industry-leading features for the clearest imaging of Cu pillars, molded flip chip (MUF), CSP, MCM, stacked die, hybrids, and other advanced package inspection applications.

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