Sonix understands the fast-paced nature of the semiconductor industry. Our ultrasonic NDT technology is designed to assure the quality and help speed production of bonded wafers and packaged semiconductors – even as the demands of progress require smaller, denser, more complex designs.
For your customers, success means being first to market with faster and smarter computers, phones, tablets, vehicle controls, medical devices and more. Your success depends on delivering the advanced wafers and chips that make these products possible. Delays, shortages and defects are simply unacceptable.
When quality and productivity matter, Sonix is your partner for:
|Sonix Overview Brochure 3.65 MB||Every generation of devices demands denser, more complex semiconductor packages|
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