Technical Papers

These downloadable pdf files provide in-depth information about nondestructive testing and evaluation of wafers and packaged semiconductors, acoustic scanning and analysis technologies, inspection best practices and other technical topics.

Bonded and Bumped Wafers Application Brief
The ability to detect extremely thin air gaps (<0.1 micron) provides superior imaging for silicon-on-insulator, coated wafers or a variety of other high-end wafer applications.
Hybrids, Multi-Chip Modules and Power Devices
See images and analysis illustrating the ability to detect very thin air gaps and penetrate dense metallic materials.
Flip Chips
Acoustic inspection of flip chips helps ensure adequate underfill flow and identify excess flux material.
Chip Scale Packages
For CSP failure analysis and process control, the ability to find very thin planar defects (< 0.1 micron) makes acoustic scanning a superior tool for imaging device integrity.
Plastic Ball Grid Arrays
Scanning acoustic microscopy is a widely used tool for detecting failure modes such as moisture-induced cracking, or popcorning, and delaminations.
Metal Ball Grid Arrays
Sonix systems provide excellent imaging of seal integrity, die attach and lead finger bond quality in SuperBGA and other metal BGA package types.
Plastic Encapsulated Integrated Circuits
Plastic encapsulated microelectronic devices are the most common application for scanning acoustic microscopes, with most inspections conducted as part of an overall failure analysis procedure.
Ceramic Chip Capacitors
Almost every capacitor manufacturer in the world uses scanning acoustic microscopy in a failure analysis or process control role.
Ceramics
Acoustic inspection can help determine the root cause and location of defects in ceramics, whether bare or incorporated within a device.
Truck Axle Study
Sonix systems have been used to determine case hardness depths in truck axles, without the need to cut into and destroy the parts.
Ultrasonic Microstructural Analyzer (UMA)
The Ultrasonic Microstructural Analyzer (UMA) provides a cost-effective, non-destructive method for measuring the hardness depth of induction hardened steel parts.
Material Characterization
Acoustic microscopy can be used to analyze the boundaries between materials and the property variations within a material.
Automotive Applications
Fully automated scanning acoustic microscope systems can be used to inspect thousands of automotive devices per day.
Miscellaneous Applications
Smart cards, composites and LTCC substrates are just a few of the applications for Sonix acoustic inspection systems.
Medical Applications
From microelectronic devices to medical packaging, acoustic inspection is indispensible to many medical device manufacturers.
Auto Analysis
The Auto Analysis application allows you to set up accept/reject criteria on each device in a tray or jump scan. The result is a pass/fail evaluation report for each device.
Cluster Analysis
Cluster Analysis can be used to find void size distribution, based on user-defined amplitude and size criteria.
TOF/Thickness Measurement
Time-of-flight is the time taken by ultrasound to propagate from one reference interface to another interface. This information can be used to measure the thickness of bonding layers and other features.
Palette Applications
A palette is used to map pixel values (signal amplitude) to pixel brightness/color to improve image contrast and clarity.
Void Gate Imaging
The Void Gate Imaging feature can be used to detect voids in mold compound, superimposing the findings over a meaningful background to aid in determining the defect location.
Simultaneous Pulse-Echo / Through-Transmission Imaging
Simultaneous pulse-echo and through-transmission imaging (PETT) enables quick defect detection and verification all in one scan.
Copper Pillar Inspection
Learn how to optimize penetration, resolution and contrast at the ultra high frequencies typically required to inspect Cu pillars that can be as small as 10–30μm in diameter.
Molded Underfill Package (MUF) Inspection
Minimize the effects of signal scattering, attenuation and shadowing to achieve clear inspection images in packages that incorporate particle-filled overmolding and underfill.
Stacked Die Package Inspection
Overcome the challenges of penetrating and resolving multiple layers to achieve clear ultrasonic inspection images in bare and overmolded stacked die packages.