Our History
Sonix began business in 1986 in Springfield, Virginia, where our corporate headquarters still reside. We quickly grew to establish additional offices across the U.S. as well as in Europe, China, South Korea, Taiwan and Malaysia, with regional representatives in all the world’s major centers for wafer and packaged semiconductor manufacturing.
Our history is one of firsts, beginning with the industry’s first PC-based nondestructive testing system in 1987. In 1990 we introduced the first IC inspection system, and throughout the decade we brought to market innovations such as automatic inspection, TAMI and ICEBERG imaging software, wafer inspection and much more.
In the 21st Century, we’ve continued to grow our global footprint and advance our capabilities with Automated Wafer scanning for faster throughput, SDI enhancement for inspecting 3D architectures, MFCI for enhanced imaging of molded flip chips and other exclusive technologies. And we’ve built a service and support organization dedicated to collaborative problem solving to advance your business and technical capabilities.
Our history, and our future, is driven by your needs. As we work to build customer relationships, everything we learn helps us build better products and deliver better service.
| 1986 | 1987 |
|---|---|
| Incorporation | First digital nondestructive imaging system |
| 1989 | 1990 |
| First Asia office | First IC inspection system |
| 1996 | 1998 |
| First automated JEDEC tray system | Introduction of TAMI imaging software |
| 1999 | 2000 |
|
First wafer inspection system Introduction of: - 3D rendering - Simulated scanning - Frequency domain imaging |
Patented Pulse Echo Thru Transmission (PETT) Introduction of Auto Analysis |
| 2002 | 2004 |
| First automated wafer inspection system | ISO 2001 certification |
| 2006 | 2009 |
| Introduction of Wave Form Simulator/Beam Emulator | ECHO platform and S-series transducers (35-75 MHz) |
| 2010 | 2011 |
| AutoWafer Pro, ECHO Pro and S-series transducers (110 MHz-UHF) | AutoWafer software, including MFCI (molded flip chip imaging), SDI (stacked die imaging), Flexible TAMI and waveform averaging |
| 2012 | |
| Introduction of 300mm SECS/GEM |
Related Literature
| File Name | Language | Date updated | File Size |
|---|---|---|---|
| Sonix Overview Brochure | en-US | 10-2012 | 3.65 MB |
Request a sample analysis
Provide a sample of your product. Sonix will provide you with an in-depth analysis report and help you develop an inspection solution designed to integrate into your process.
Sonix®, Inc
8700 Morrissette Drive
Springfield, VA 22152
703.440.0222
8700 Morrissette Drive
Springfield, VA 22152
703.440.0222
All Sonix, Inc. information is Copyright © Sonix Inc. 1999-2021
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