Hybrid and Multi-Chip Module (MCM) Package Inspection

Hybrid and Multi-Chip Module (MCM) Package Inspection

Hybrid and Multi-Chip Module (MCM) Package Inspection

Features

Sonix systems have the ability to detect very thin air gaps and easily penetrate dense metallic materials used in multi-chip module (MCM) and hybrid integrated circuit designs. Typical multi-chip inspection applications include qualifying of solder material and deposition to prevent overheating failures and inspection of lid seals to ensure they won’t become compromised over time. Now, as stacked die and flip chip techniques become common, advanced ultrasonic multi-chip inspection techniques have become even more important to identify MCM and hybrid chip module features.

Failure Types Commonly Detected:

  • Heat sink solder bond integrity
  • Substrate bond integrity
  • Die bond integrity
  • Lid seal bond quality
  • Die cracks
  • Insufficient solder material
  • Excessive solder reflow
  • Seal integrity

Resources for Hybrid and Multi-Chip Module

Hybrids, Multi-Chip Modules and Power Devices127 KBDue to SAMs superior ability of detect very thin air gaps and ability to easy penetrate dense metallic materials, acoustic inspection of hybrids is a dominant failure analysis technique.DOWNLOAD
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