Sonix systems have the ability to detect very thin air gaps and easily penetrate dense metallic materials used in multi-chip module (MCM) and hybrid integrated circuit designs. Typical multi-chip inspection applications include qualifying of solder material and deposition to prevent overheating failures and inspection of lid seals to ensure they won’t become compromised over time. Now, as stacked die and flip chip techniques become common, advanced ultrasonic multi-chip inspection techniques have become even more important to identify MCM and hybrid chip module features.
|This advanced scanning acoustic microscope features the Sonix Image Enhancement Suite for industry-leading image quality.||Sonix ECHO provides a universal inspection tool for 3D package development, production and failure analysis.|
|Our next-generation solution for high-volume production environments adds fully automated JEDEC tray handling to maximize productivity.|
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