Download these pdf files for more information about nondestructive testing (NDT) and how Sonix NDT products can be used to identify and analyze defects in a wide variety of applications.
Learn more about the new pulse2 pulser/receiver, including key benefits and a comparison of defects uncovered at a substrate level.
Review the key features, benefits and specifications of our ECHO platform for packaged semiconductor inspection.
Generate both pulse-echo and through-transmission images in a single scan for efficient defect analysis and higher throughput.
The basic software included on all Sonix systems. WinIC provides advanced image analysis features to aid in quantitative and qualitative interpretation of image data.
Learn how to perform 100 percent inspection of complex packages in a single scan.
Use our powerful offline analysis software to simulate scanning, generate new images from your existing data set and enhance analysis to reveal features that might otherwise remain hidden.
Learn how the Sonix MFCI technique improves image resolution and contrast by reducing the scattering and attenuation effects in scans of molded flip chips.
Set gate spacing and length independently, so that each gate contains meaningful data and fewer gates are required.
Our stacked die imaging (SDI) technique equalizes the amplitude of deeper reflections without affecting shallower reflections, allowing all interfaces in a 3D sample to be inspected in a single scan.
Our robust S-series 35 – 75 MHz transducers reduce delay lines to provide improved spatial resolution.
See examples of our S-series 75 MHz transducers used in pulse-echo, through transmission, and simultaneous pulse-echo / through transmission (PETT) modes.
Get improved signal sensitivity, reduced delay line reflections and more robust performance for PE and other inspection tasks.
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