Historically, acoustic scanning microscopes were found primarily in back-end development and manufacturing of packaged semiconductors. Today, front-end manufacturers are also adopting nondestructive testing (NDT) as a wafer solution. Manufacturers are performing semiconductor wafer inspection and wafer metrology to help streamline product development, refine manufacturing processes, improve yield and ensure the long-term reliability of their products.
Relentless market demands for smaller, smarter products require a wafer solution that helps eliminate defects and improve yields from the very beginning of the fabrication process. To meet the need, Sonix developed AutoWafer, the industry’s first wafer solution that enables fully automated inspection. With automated wafer processing and wafer analysis features, AutoWafer is optimized for production-speed inspection of MEMS, TSV, LED, BSI and other bonded wafer technologies.
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