Ball Grid Arrays (BGAs) are the dominant method of connecting chips packaged in a variety of ways to the main board. Because BGA package technology is so widely used, BGA inspection is among the most common applications for acoustic microscopy. The Sonix ECHO platform is the ideal BGA inspection platform.
Sonix has extensive experience with BGA package technology, helping customers identify BGA defects such as moisture-induced cracking, delaminations, lid seal integrity, die attach and other defects in both plastic and metal BGA packages. That’s why so many manufacturers worldwide choose Sonix BGA inspection systems to identify and characterize:
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|This advanced scanning acoustic microscope features the Sonix Image Enhancement Suite for industry-leading image quality.||Sonix ECHO provides a universal inspection tool for 3D package development, production and failure analysis.|
|Our next-generation solution for high-volume production environments adds fully automated JEDEC tray handling to maximize productivity.|
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