Chip scale packages (CSPs) allow for integration of greater functionality in a much smaller package. Today’s consumer devices require smaller and more powerful CSPs, with thinner materials and more complex layouts. As wafer packaging processes become more difficult and involved, the potential for chip package quality failures is a greater concern. Minimize quality risks in wafer level chip scale packages with Sonix solutions.
Sonix has the expertise to help you image specific interfaces of interest within the chip scale package, efficiently gathering the most useful data so you can maintain the multi-chip package throughput you need. With high resolution imaging of planar defects of less than 0.1 micron, Sonix systems identify and characterize:
|This advanced scanning acoustic microscope features the Sonix Image Enhancement Suite for industry-leading image quality.||Sonix ECHO provides a universal inspection tool for 3D package development, production and failure analysis.|
|Our next-generation solution for high-volume production environments adds fully automated JEDEC tray handling to maximize productivity.|
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