The first microelectronic application for scanning acoustic microscopes was inspecting for moisture-induced “popcorn” cracks in plastic-encapsulated IC packages. Today, the newest generation of Sonix acoustic microscopes is ideal for imaging traditional IC chip crack defects as well as a much broader range of defects in the widest range of plastic-encapsulated IC packages.
Sonix acoustic scanning microscopes offer precise IC inspection imaging for reliable defect detection and failure analysis – with the throughput needed for manufacturers who want to implement 100% inspection of production ICs. Automated inspection of IC chips can identify and characterize:
|This advanced scanning acoustic microscope features the Sonix Image Enhancement Suite for industry-leading image quality.||Sonix ECHO provides a universal inspection tool for 3D package development, production and failure analysis.|
|Our next-generation solution for high-volume production environments adds fully automated JEDEC tray handling to maximize productivity.|
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