Plastic-Encapsulated IC Inspection

The first microelectronic application for scanning acoustic microscopes was inspecting for moisture-induced “popcorn” cracks in plastic-encapsulated IC packages. Today, the newest generation of Sonix acoustic microscopes is ideal for imaging traditional IC chip crack defects as well as a much broader range of defects in the widest range of plastic-encapsulated IC packages.

Plastic-Encapsulated IC Package Inspection with Sonix

Sonix acoustic scanning microscopes offer precise IC inspection imaging for reliable defect detection and failure analysis – with the throughput needed for manufacturers who want to implement 100% inspection of production ICs. Automated inspection of IC chips can identify and characterize:

• Non-bonded interfaces
• Die tilt or cupping
• Porous or insufficient die attach
• Die cracks
• Delaminations
• Molding compound voids
• IC package cracks (“popcorn” cracks)
• Lead frame delamination