A flexible, automated wafer inspection system designed for production, AutoWafer Pro provides fast, high-resolution scanning of 200mm and 300mm bonded wafers. It’s the ideal ultrasonic equipment for identifying bond defects in wafer applications such as MEMS, BSI Sensors, CMOS, memory, TSV and LED.
With extensive analysis capabilities at both the wafer and device level, there’s no need to reload and rescan wafers to get all the diagnostic images you need. And with high-speed scanning managed by fully automated wafer handling, AutoWafer Pro supports 100% nondestructive testing (NDT) for improved yields and a faster time to market.
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