As circuits become exponentially smaller, defects have become smaller and more difficult to detect. Finding defects is critical to preventing thermal, mechanical and electrical failures. To ensure no defects reach the customer, packaged semiconductor manufacturers are looking for finer-resolution imaging and advanced analytic capabilities to fine-tune their designs and processes. In addition, customers require higher throughput to enable 100% semiconductor inspection at production speeds.
Since 1986, Sonix has provided scanning acoustic microscopes that have facilitated new generations of faster and smarter computers, phones, tablets, vehicle controls, medical devices and more. Sonix has continued to improve semiconductor inspection technology to meet the challenges of today’s most complex packaging.
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