To identify the smallest and most subtle defects in leading-edge packaged microelectronic applications, ECHO VS includes standard features such as heated water for optimum acoustic coupling, Flexible TAMI for efficient capture of the most useful data, Waveform Averaging for an improved signal-to-noise ratio, ICEBERG for improved image quality and MFCI for enhanced image quality in the most demanding applications. ECHO VS is the ultimate ultrasonic NDT equipment for molded flip chip, CSP, MCM, stacked die, MUF and other advanced packaging technologies.
File Name | Language | Date updated | File Size |
---|---|---|---|
Sonix Overview Brochure | en-US | 10-2012 | 3.65 MB |
Get the latest industry and technology updates from Sonix.