Sonix offers powerful wafer software tools to enhance bonded wafer imaging, accelerate production and adapt AutoWafer and AutoWafer Pro to our customers’ specific requirements.
Wafer software tools can be supplied as an integral feature of any Sonix automated wafer inspection system, providing a complete solution for customer production environments and products.
In some cases, it may be possible to add wafer software to enhance existing systems, although this may require additional hardware upgrades to ensure compatibility.
In addition to the wafer software described in the downloads below, the following options are also available:
SECS/GEM is available in a 200mm version for AutoWafer and a 300mm version for AutoWafer Pro, providing an industry-standard interface to host equipment for data collection, wafer movement and process execution. [optional]
Reporting Capability
KLARF report output format [optional]
Sonix offers powerful wafer software tools to enhance bonded wafer imaging, accelerate production and adapt AutoWafer and AutoWafer Pro to our customers’ specific requirements.
Sonix S-series ultrasonic NDT transducers are designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. We offer the collaborative expertise to help customers choose the best ultrasonic NDT transducer for their application.
Provide a sample of your product. Sonix will provide you with an in-depth analysis report and help you develop an inspection solution designed to integrate into your process.
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